QBT-J compact - Compact dual-chamber dual-angle ultra-high vacuum coating system
Product Overview
Compared with the four-chamber QBT-J, the core advantage of the QBT-J compact lies in its complete equipment functions and highly compact design, which can effectively save cleanroom floor space, enhance the overall operational reliability of the machine, optimize the process flow, and significantly improve efficiency and production capacity. The pre-treatment chamber is equipped with functions such as sample loading, ion beam etching, and oxidation. Compared with competing products, the entire machine adopts an ultra-high vacuum design, which can better ensure the processing of precision devices with strict requirements for interface ultra-high purity and reproducibility, such as superconducting quantum chip Josephson junctions.
Technical Advantages
It includes two ultra-high vacuum chambers: the sample loading chamber (for ion beam etching and oxidation) and the electron beam evaporation chamber
Sample size: Supports up to 4-inch wafers, compatible with fragments
Manipulator temperature: Room temperature - 900°C or liquid nitrogen cooling
Ultimate vacuum of the loadlock chamber: ≤ 9E-9 Torr
Ultimate vacuum of the electron beam evaporation chamber: ≤ 5E-9 Torr
Coating uniformity: 1σ < 2% (4-inch wafer, 5mm edge exclusion, 200nm aluminum)
Manual sample loading, fully automatic precise wafer transfer, supports double-angle coating
It features complete functions, compact structure, small floor space, high cost performance and high stability of the whole machine.
Fully automatic process, comes with built-in programs from the factory, and supports customization
