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QBT-MPVMulti-target Ultra-high Vacuum Magnetron Vertical Sputtering System

YunmaoProduct Overview

QBT-MPV is an upgraded system from QBT-P. Compared to QBT-P, QBT-MPV includes up to 4 magnetron cathodes (upon request) in one sputtering chamber, enabling multi-layer process, such as Nb/Al-AlOx/Nb, Al/AlOx/Al, or even α-Ta/TaOx/α-Ta junctions. The system is also compatible with seed layer based process.

YunmaoTechnical Advantages

Dimension(L x W x H): 2600*1600*2200 mm

Process Chamber Ultimate Pressure: ≤3E-9 Torr

Process Temperature: 0-900°C or water cooled positions

Sample Size: Max 4 inch Wafer and smaller chips compatible

Uniformity: <±5% (4 inch wafer with 5 mm removal from the edge)

Power Supply: 1kW DC power or 750W RF (Upon request)

Magnetron Cathode: Four 4-6 inch Ultra High Vacuum Magnetron Cathodes(Upon request)

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Application

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Optics

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Semiconductor

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Perovskite

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